Effects of Annealing Temperature on Interfacial Structure and Thermal Conductivity of Hot-Pressed Copper/Cr-Coated Diamond Composites

, corresponding to 211% of the experimentally measured value for the uncoated sample. Analyses combining the diffusion mismatch model and experimentation indicate that the enhancement originates from improved phonon spectral matching and increased interfacial adhesion energy. This work provides processing guidance for precise interface engineering in high-thermal-conductivity diamond/copper composites.