Electrical resistivity of microstructural components in Al–Mg-Si alloys

Abstract Al–Mg–Si alloys are utilized in large-scale electrical conduction applications thanks to their low density, high strength, and low electrical resistivity. The alloying elements, Mg and Si, are introduced to improve the mechanical strength; however, the formed defects also suppress electrical conductivity, adversely affecting the material performance. Here, we investigate the impact of alloying, heat treatment, and the corresponding microstructure, on the electrical resistivity of overaged alloys having 0.5–9.5 at. % solute. The crystal structure, composition, and microstructure are characterized by X-ray diffraction, energy-dispersive X-ray spectroscopy, electron backscatter diffraction, and scanning electron microscopy (SEM). The electrical resistivity of the microstructural components, i.e., the Al solid solution matrix and the Si and Mg 2 Si precipitates, is directly measured using a microscale four-point probe setup inside the SEM. We find that the Al solid solution matrix is up to 15% more resistive than pure Al, depending on the heat treatment rather than the composition, and that regions including Si or Mg 2 Si precipitates are equally resistive. Additionally, the bulk alloy resistivity, measured conventionally on a macroscopic length scale, increases linearly up to 60% with increasing total solute concentration up to ~ 10 at. %. This study relates the electrical resistivity of Al–Mg–Si alloys, measured at microscopic and macroscopic length scales, with their microstructure and composition.