Enhancing Debonding of Epoxy-Based Structural Adhesives with Hybrid Dynamic Curing Agents

-β-amino ester) hybrid dynamic curing agent. The use of such a hybrid dynamic curing agent for the epoxy curing reaction results in processable cross-linked materials with a stress relaxation activation energy of 147 kJ/mol, compared to 165 and 140 kJ/mol for the amide and ester counterparts, thus highlighting the contribution of β-amino ester motifs. We further employ the hybrid dynamic curing agent for debondable adhesive formulations, demonstrated on varying substrates including metal, wood, and composite. An excellent adhesive lap shear strength of up to 16 MPa is achieved with enhanced debonding capability that facilitates the nondestructive disassembly of bonded components, especially advantageous for heat-labile wooden and composite materials.