Influence of Chemical Composition and Electro-Steel Sheets Manufacturing Parameters on the Adhesion of an Electro-Insulating Self-Bonding Varnish Layer
One promising innovative joining process for non-oriented electrical sheets is based on an electro-insulating layer combined with a self-bonding varnish. The aim of this study was to investigate the adhesion of the self-bonding varnish as evaluated by a lap-shear test. During the experiments, non-oriented electrical steels with low to high silicon content were analyzed and tested. The Si content, the bond thickness, and the surface roughness Ra, as well as the selected steel production parameters—such as the radiation tube furnace temperature (RTF), the grain growth temperature (i.e., heating temperature (HF)), the peak metal temperature (PMT), and the annealing atmosphere (dry or humid, controlled by dew point)—were considered as the variables. The results showed that the lap-shear strength was independent of the surface roughness within the investigated range. In contrast, the bond thickness exhibited a weak positive effect on the lap-shear strength, while the Si content showed condition-dependent behavior. The RTF and the HF resulted in a relatively stable mechanical performance, whereas the PMT and the humid annealing atmosphere were identified as critical factors influencing adhesion.
Authors
- Anna Guzanová (ORCID: https://orcid.org/0000-0002-1822-573X)
- Emil Evin (ORCID: https://orcid.org/0000-0003-2712-1526)
- Miroslav Tomáš (ORCID: https://orcid.org/0000-0002-8666-5163)
- Ján Slota (ORCID: https://orcid.org/0000-0002-9054-0902)
- Stanislav Németh
- Matúš Horváth
- Vladimír Kundracík
- Iveta Filipovská
- Vanda Tomková
Institutions
- Technical University of Košice (SK)
- University of Veterinary Medicine in Košice (SK)
- Ocná klinika (SK)
Publication Details
- Journal
- Crystals
- Published
- 2026-04-10
- DOI
- https://doi.org/10.3390/cryst16040253
- Primary Topic
- Mechanical Behavior of Composites
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- Slovenská Akadémia Vied
- Agentúra na Podporu Výskumu a Vývoja
- Vedecká Grantová Agentúra MŠVVaŠ SR a SAV