Heterogeneous 3D Integration Based on Atomic-Level Electronics

diffusive memristors produce threshold-driven, biologically inspired spiking. These layers form a compact neuromorphic stack capable of synaptic plasticity, firing-rate modulation, temporal learning, analog in-memory computation, and convolutional feature extraction. This architecture allows layers to be manipulated enabling on-demand compute scaling. Demonstrations of analog vector-matrix multiplication for CNN inference and image filtering─achieving 93.1% CIFAR-10 accuracy under realistic nonidealities─highlight the platform's capability for energy-efficient, beyond-von Neumann computation. The proposed 2D-material-based platform enables heterogeneous functional partitioning while preserving programmability across vertically integrated tiers. The unified 3D architecture supports multimodal neuromorphic operation with layer-level specialization and intertier signal coupling, covalidating learning and system-level functionality within a single integrated stack.

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Publication Details

Journal
ACS Applied Materials & Interfaces
Published
2026-04-07
DOI
https://doi.org/10.1021/acsami.6c00756
Primary Topic
Semiconductor materials and devices
Type
article
Field-Weighted Citation Impact
0.00

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article

Heterogeneous 3D Integration Based on Atomic-Level Electronics

Hyunho Seok, D. H. Lee, Seowoo Son, Jinhyoung Lee et al.
ACS Applied Materials & Interfaces
Semiconductor materials and devices
article

Heterogeneous 3D Integration Based on Atomic-Level Electronics

Hyunho Seok, D. H. Lee, Seowoo Son, Jinhyoung Lee, Gunhyoung Kim, Sihoon Son, Hyunbin Choi
article en

Abstract

diffusive memristors produce threshold-driven, biologically inspired spiking. These layers form a compact neuromorphic stack capable of synaptic plasticity, firing-rate modulation, temporal learning, analog in-memory computation, and convolutional feature extraction. This architecture allows layers to be manipulated enabling on-demand compute scaling. Demonstrations of analog vector-matrix multiplication for CNN inference and image filtering─achieving 93.1% CIFAR-10 accuracy under realistic nonidealities─highlight the platform's capability for energy-efficient, beyond-von Neumann computation. The proposed 2D-material-based platform enables heterogeneous functional partitioning while preserving programmability across vertically integrated tiers. The unified 3D architecture supports multimodal neuromorphic operation with layer-level specialization and intertier signal coupling, covalidating learning and system-level functionality within a single integrated stack.

ACS Applied Materials & InterfacesVol. 18(15)
Institute of Nanotechnology (GB), Massachusetts Institute of Technology (US), Sungkyunkwan University (KR)
Sungkyunkwan University
Openalex Percentile: Top 25%
Semiconductor materials and devices
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