Heterogeneous 3D Integration Based on Atomic-Level Electronics
diffusive memristors produce threshold-driven, biologically inspired spiking. These layers form a compact neuromorphic stack capable of synaptic plasticity, firing-rate modulation, temporal learning, analog in-memory computation, and convolutional feature extraction. This architecture allows layers to be manipulated enabling on-demand compute scaling. Demonstrations of analog vector-matrix multiplication for CNN inference and image filtering─achieving 93.1% CIFAR-10 accuracy under realistic nonidealities─highlight the platform's capability for energy-efficient, beyond-von Neumann computation. The proposed 2D-material-based platform enables heterogeneous functional partitioning while preserving programmability across vertically integrated tiers. The unified 3D architecture supports multimodal neuromorphic operation with layer-level specialization and intertier signal coupling, covalidating learning and system-level functionality within a single integrated stack.
Authors
- Hyunho Seok (ORCID: https://orcid.org/0000-0002-3189-5930)
- D. H. Lee
- Seowoo Son (ORCID: https://orcid.org/0009-0004-9032-3491)
- Jinhyoung Lee
- Gunhyoung Kim
- Sihoon Son
- Hyunbin Choi
Institutions
- Institute of Nanotechnology (GB)
- Massachusetts Institute of Technology (US)
- Sungkyunkwan University (KR)
Publication Details
- Journal
- ACS Applied Materials & Interfaces
- Published
- 2026-04-07
- DOI
- https://doi.org/10.1021/acsami.6c00756
- Primary Topic
- Semiconductor materials and devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- Sungkyunkwan University