Metallic Conductance in Palladium Nanowires Templated by DNA Origami Molds

Downscaling nanoelectronic circuits with conventional lithography becomes increasingly demanding. The quest for less laborious and more sustainable alternatives has sparked investigations attempting to self‐assemble electronics. DNA origami molds offer an exceptional platform for templating metallic nanostructures, enabling programmability and spatial control over nanowire formation. For electrical interconnects, a range of materials capable of forming reliable ohmic contacts is essential. Here, we present the self‐assembly and full electrical characterization of Pd nanowires based on DNA origami molds. The nanowires exhibit metallic behavior showing linear current–voltage characteristics and a decreasing resistance with lowering temperature. While annealing strategies lead to a decrease in conductance, structural rearrangements induced by the applied electric field can either enhance or inhibit charge transport. These findings highlight the potential of DNA‐templated Pd nanowires as self‐assembled metallic interconnects with tuneable electric properties suitable for nanoelectronic circuits.