Near-field imaging of buried conductors using transient EM signal transfer

A novel time-domain electromagnetic (TDEM) technique for reliable detection and imaging of visually obscured buried conductors using only two rapidly acquired measurements via a simple and cost-effective antenna system is presented. This non-invasive method exploits transient electromagnetic (EM) interactions to detect contrasts in electrical conductivity between targets and the surrounding medium. This approach provides a practical and flexible alternative to conventional subsurface sensing technologies. The presented results show that the proposed technique yields accurate and repeatable outcomes across various shapes of buried targets.

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Publication Details

Journal
Scientific Reports
Published
2026-04-03
DOI
https://doi.org/10.1038/s41598-026-46396-y
Primary Topic
Microwave Imaging and Scattering Analysis
Type
article
Field-Weighted Citation Impact
0.00

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article

Near-field imaging of buried conductors using transient EM signal transfer

Martin Štumpf, Tomáš Doležal
Scientific Reports
Microwave Imaging and Scattering Analysis
article

Near-field imaging of buried conductors using transient EM signal transfer

Martin Štumpf, Tomáš Doležal
article en

Abstract

A novel time-domain electromagnetic (TDEM) technique for reliable detection and imaging of visually obscured buried conductors using only two rapidly acquired measurements via a simple and cost-effective antenna system is presented. This non-invasive method exploits transient electromagnetic (EM) interactions to detect contrasts in electrical conductivity between targets and the surrounding medium. This approach provides a practical and flexible alternative to conventional subsurface sensing technologies. The presented results show that the proposed technique yields accurate and repeatable outcomes across various shapes of buried targets.

Scientific Reports
Luleå University of Technology (SE), Brno University of Technology (CZ)
Akademie Věd České Republiky
Openalex Percentile: Top 10%
Microwave Imaging and Scattering Analysis
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