Optimization of Processing Parameters and Application Performance Evaluation of a High Thermal Conductivity, Low Thermal Resistance Gel

and a bonding strength of 0.248 MPa, outperforming commercial counterparts and demonstrating promising application potential. It was further concluded, through comparisons of curing rheology and long-term reliability evolution with commercial counterparts, that the self-developed thermal conductive gel possesses enhanced stability and reliability. This study provides a practical reference for the development and engineering application of high thermal conductivity, low thermal resistance gels.