Effect of Adhesive Curing Parameters on the Tensile Strength of Bonded Joints in Pull-Off Tests

In the present study, the influence of the parameters of the bonding process, namely the applied pressure during curing, as well as the duration and temperature of curing, on the tensile strength of the bonded joints was investigated. Pull-off tests were conducted in accordance with the ASTM C633 standard. The samples were bonded using a single-component thermosetting adhesive, HTK Ultra Bond 100. On the basis of the results obtained, it was concluded that the tensile strength of the bonded joint, and thus its overall quality, is strongly influenced by the curing parameters of the thermosetting adhesive. The most effective bonding conditions were identified.