An Ultrasonic Micro-Tool Assisted Platform for Post-Processing of Micrometer-Scale Copper Wires

Acoustic microactuation technology has emerged as an effective approach for fabrication of micro- and nanoscale objects, enabling precise processing and shaping control of microscale materials by efficiently transmitting ultrasonic vibration energy and focusing energy locally. In this work, the proposed platform is regarded as an acoustically driven micromachine, in which ultrasonic excitation acts as the primary microactuation mechanism. Micrometer-scale copper wires are widely used in microelectronics and precision manufacturing. However, their small dimensions and low rigidity make fixation and forming particularly challenging. To achieve controllable forming of fine copper wires, this study introduces an ultrasonic vibration energy-focusing principle and investigates an ultrasonic post-processing method tailored for such materials, with the aim of enhancing processing stability and forming accuracy. An ultrasonic processing experimental platform for copper wires was established, and multiple micro-tool designs—including glass fiber, 304 stainless steel wire with support, and elastic hard 304 stainless steel—were evaluated. Single-point and continuous processing experiments were conducted by varying micro-tool materials and support configurations, and the influence of feed speed on processing width and depth was systematically analyzed. The results indicate that a hard 304 stainless steel micro-tool supported by a hard plastic ring provides the best overall performance. Feed speed has a significant effect on processing depth, with a maximum average depth of approximately 0.95 μm achieved at a feed speed of 1 mm/min. These findings demonstrate the feasibility of ultrasonic processing for the effective forming of fine copper wires and confirm that appropriate micro-tool design and feed speed are critical for achieving stable and reliable processing results. The proposed system employs an ultrasonically actuated micro-tool to perform post-processing on micrometer-scale copper wires. The ultrasonic vibration serves as a microactuation mechanism that enhances local deformation and material response during micro-machining.