Revealing Intrinsic Excitonic and Interlayer Coupling in CVD-Grown TMDCs via a Bubble-Free Interface

The integration of van der Waals (vdW) materials, especially those grown by chemical vapor deposition (CVD), is often hindered by interfacial contamination, bubble formation, and chemical damage during transfer. Here, we demonstrate an hBN-assisted encapsulation strategy that leverages the strong adhesion between hBN and CVD-grown transition metal dichalcogenides (TMDCs) to lift them cleanly from SiO<sub>2</sub> substrates without the use of harsh chemicals. A hot inclined touch-down method applied during stacking minimizes interfacial defects and bubble formation, preserving optical integrity. This process enables the assembly of high-quality homo- and heterobilayers, such as MoS<sub>2</sub>/MoS<sub>2</sub>, WSe<sub>2</sub>/WSe<sub>2</sub>, and WSe<sub>2</sub>/MoSe<sub>2</sub>, which exhibit enhanced excitonic features and pronounced interlayer Raman modes, as well as spatially indirect excitons, confirming strong interlayer coupling. The technique is compatible with patterned or suspended substrates, thereby expanding its applicability to studies of strain and environmental effects. Our all-dry encapsulation method yields optically pristine hBN/TMDC heterostructures from CVD-grown materials, paving the way for next-generation 2D optoelectronic and quantum devices.

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Publication Details

Journal
ACS Applied Materials & Interfaces
Published
2026-03-27
DOI
https://doi.org/10.1021/acsami.5c23672
Primary Topic
Organic Electronics and Photovoltaics
Type
article
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article

Revealing Intrinsic Excitonic and Interlayer Coupling in CVD-Grown TMDCs via a Bubble-Free Interface

Sudipta Majumder, Rahul Chand, Sagnik Chatterjee, Meghasree Basu et al.
ACS Applied Materials & Interfaces
Organic Electronics and Photovoltaics
article

Revealing Intrinsic Excitonic and Interlayer Coupling in CVD-Grown TMDCs via a Bubble-Free Interface

Sudipta Majumder, Rahul Chand, Sagnik Chatterjee, Meghasree Basu, Avinash Mahapatra, G. V. Pavan Kumar, Pradeepa H L, Kenji Watanabe, Sweta Verma, Atikur Rahman, Takashi Taniguchi, Ashutosh Shukla
article en

Abstract

The integration of van der Waals (vdW) materials, especially those grown by chemical vapor deposition (CVD), is often hindered by interfacial contamination, bubble formation, and chemical damage during transfer. Here, we demonstrate an hBN-assisted encapsulation strategy that leverages the strong adhesion between hBN and CVD-grown transition metal dichalcogenides (TMDCs) to lift them cleanly from SiO<sub>2</sub> substrates without the use of harsh chemicals. A hot inclined touch-down method applied during stacking minimizes interfacial defects and bubble formation, preserving optical integrity. This process enables the assembly of high-quality homo- and heterobilayers, such as MoS<sub>2</sub>/MoS<sub>2</sub>, WSe<sub>2</sub>/WSe<sub>2</sub>, and WSe<sub>2</sub>/MoSe<sub>2</sub>, which exhibit enhanced excitonic features and pronounced interlayer Raman modes, as well as spatially indirect excitons, confirming strong interlayer coupling. The technique is compatible with patterned or suspended substrates, thereby expanding its applicability to studies of strain and environmental effects. Our all-dry encapsulation method yields optically pristine hBN/TMDC heterostructures from CVD-grown materials, paving the way for next-generation 2D optoelectronic and quantum devices.

ACS Applied Materials & Interfaces
National Institute for Materials Science (JP)
Openalex Percentile: Top 6%
Organic Electronics and Photovoltaics
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