The Optimization of Non-Uniformity for Copper Electrodeposition with a Tertiary Current Distribution Numerical Model

This study investigates the non-uniformity (NU%) of copper deposition in a three-dimensional panel electroplating cell using COMSOL Multiphysics® 6.1 (COMSOL Inc., Burlington, MA, USA). To ensure the accuracy of the simulated current efficiency, the modeling was initially conducted on the electrodeposition of nanoscale metal wires (Nanowires, NWs) using the Finite Element Method (FEM) in COMSOL. After verifying that the simulation accurately reflected the current efficiency at the nanoscale, the model was scaled up to simulate full-sized panel-level electroplating. Various simulation conditions were explored, including two dimensional and three dimensional, electrode kinetics equations, electrolyte compositions, and current densities. The effects of these parameters on current efficiency and deposition uniformity were analyzed to develop a highly accurate COMSOL model. In terms of electrode kinetics, the study compares the advantages and limitations of secondary current distribution and tertiary current distribution models found in the previous literature, and evaluates their simulation results. Furthermore, to reflect the experimental condition where a pre-deposited copper seed layer was applied to reduce internal cathode resistance, the electrode shell physics module in COMSOL was implemented to simulate the potential distribution across the cathode surface. The results confirm that the numerical model using the tertiary current distribution provides more accurate predictions compared to the conventional secondary current distribution approach.