Improving Flame Retardancy and Heat Resistance of Printed Circuit Board Materials via Poly(2,6-dimethyl-1,4-phenylene sulfide) Blending

Authors

Akihiko Happoya
Hidenori Fujimoto
M. Nagata
Shinsuke Ishikawa
Daisuke Ito

Institutions

Daicel (Japan) (JP)
Kobe University (JP)

Publication Details

Journal: Journal of The Japan Institute of Electronics Packaging
Published: 2026-01-01
DOI: https://doi.org/10.5104/jiep.jiep-d-25-00099
Primary Topic: Flame retardant materials and properties
Type: article
Field-Weighted Citation Impact: 0.00

Controls

|||

ALL TIME

JAN

FEB

MAR

APR

MAY

JUN

JUL

AUG

SEP

OCT

article

Improving Flame Retardancy and Heat Resistance of Printed Circuit Board Materials via Poly(2,6-dimethyl-1,4-phenylene sulfide) Blending

Akihiko Happoya, Hidenori Fujimoto, M. Nagata, Shinsuke Ishikawa et al.

Jan 1, 2026

Journal of The Japan Institute of Electronics Packaging

Flame retardant materials and properties

article

Improving Flame Retardancy and Heat Resistance of Printed Circuit Board Materials via Poly(2,6-dimethyl-1,4-phenylene sulfide) Blending

Akihiko Happoya, Hidenori Fujimoto, M. Nagata, Shinsuke Ishikawa, Daisuke Ito

January 1, 2026article en

Abstract

No abstract available for this paper.

Journal of The Japan Institute of Electronics Packaging

Daicel (Japan) (JP), Kobe University (JP)

Affordable and clean energy

Openalex Percentile: Top 10%

Flame retardant materials and properties

DOI Source OpenAlex

AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.

Improving Flame Retardancy and Heat Resistance of Printed Circuit Board Materials via Poly(2,6-dimethyl-1,4-phenylene sulfide) Blending — Akihiko Happoya, Hidenori Fujimoto, et al. · Journal of The Japan Institute of Electronics Packaging (2026) | TGRS Research Map | TGRS