Optical characterization of heavy-ion induced damage in 4H-SiC

The interaction between silicon carbide and heavy ions is governed by both the material properties of SiC and the characteristics of the heavy ions. Relevant heavy-ion parameters include the total stopping power (S), its components, electronic stopping power (Se) and nuclear stopping power (Sn), the linear energy transfer, and the ion energy, while irradiation conditions are characterized by the fluence. This study examines how the parameters of the incoming ions influence the total number of silicon vacancies (VSi) generated, the damage to the crystal structure, and, consequentially, the induced strain. Heavy-ion–induced damage was characterized using photoluminescence spectroscopy and Raman spectroscopy. The results indicate that increasing S at the surface increases VSi concentration, reduces crystallinity, and introduces broad Raman features, whereas low S values at the surface can improve the crystalline quality. The strain induced by heavy ions exhibits distinct S-dependent trends depending on Sn and the fluence. These findings advance the understanding of SiC–heavy-ion interactions by clarifying the impact of S and fluence on VSi formation and crystal damage.

Publication Details

Journal
Journal of Applied Physics
Published
2026-03-24
DOI
https://doi.org/10.1063/5.0318711
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
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article

Optical characterization of heavy-ion induced damage in 4H-SiC

Journal of Applied Physics
Silicon Carbide Semiconductor Technologies
article

Optical characterization of heavy-ion induced damage in 4H-SiC

article en

Abstract

The interaction between silicon carbide and heavy ions is governed by both the material properties of SiC and the characteristics of the heavy ions. Relevant heavy-ion parameters include the total stopping power (S), its components, electronic stopping power (Se) and nuclear stopping power (Sn), the linear energy transfer, and the ion energy, while irradiation conditions are characterized by the fluence. This study examines how the parameters of the incoming ions influence the total number of silicon vacancies (VSi) generated, the damage to the crystal structure, and, consequentially, the induced strain. Heavy-ion–induced damage was characterized using photoluminescence spectroscopy and Raman spectroscopy. The results indicate that increasing S at the surface increases VSi concentration, reduces crystallinity, and introduces broad Raman features, whereas low S values at the surface can improve the crystalline quality. The strain induced by heavy ions exhibits distinct S-dependent trends depending on Sn and the fluence. These findings advance the understanding of SiC–heavy-ion interactions by clarifying the impact of S and fluence on VSi formation and crystal damage.

Journal of Applied PhysicsVol. 139(12)
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Silicon Carbide Semiconductor Technologies
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