Spatially Quantitative Profiling of Defect Density for Hydrogen-Induced Passivation Mechanism of Metal–Insulator–Semiconductor Photoanodes

Silicon-based metal-insulator-semiconductor (MIS) photoelectrodes provide a built-in field for photoelectrochemical water splitting but suffer from inefficient charge transport due to carrier recombination at defect sites within the space-charge region. The insulating layer fabricated by atomic layer deposition (ALD) is critical for defect passivation and requires carefully engineered deposition and annealing processes for optimal performance. This necessitates the quantitative analysis of defect density distribution. However, such analysis remains impeded by intrinsic limitations of conventional single-capacitance techniques and the influence of tunneling leakage currents. This paper describes an integrated multicapacitance methodology that combines drive-level capacitance profiling (DLCP) and capacitance-voltage (C-V) techniques to quantify both interface (<i>N</i><sub>it</sub>) and bulk defect charge density (<i>N</i><sub>DLCP</sub>) within the space-charge region, using the space-charge capacitance refined by MIS-adapted multicomponent equivalent circuit modeling. This approach reveals that Al<sub>2</sub>O<sub>3</sub> reduces the <i>N</i><sub>it</sub> at n-Si/ITO interface from approximately 2.9 × 10<sup>16</sup> to 1.4 × 10<sup>16</sup> cm<sup>-3</sup>, while simultaneously profiling the variation of <i>N</i><sub>DLCP</sub> and depletion width. Furthermore, systematic DLCP/C-V analysis enables the design of a tailored passivation protocol by tuning ALD deposition (<i>T</i><sub>dep</sub>) and annealing temperatures to leverage the hydrogen-induced mechanism. Optimal passivation is achieved at a moderate <i>T</i><sub>dep</sub> (∼160 °C) followed by 350 °C annealing, which balances sufficient hydrogen content and suitable structural properties of the Al<sub>2</sub>O<sub>3</sub> film without introducing additional bulk defects during annealing. Eventually, the optimized n-Si/SiO<sub><i>x</i></sub>/Al<sub>2</sub>O<sub>3</sub>/ITO/Ni photoanode exhibits an onset potential of 0.88 V vs RHE and an applied bias photon-to-current efficiency (ABPE) of 2.91%, with a long-term stability of 120 h.

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Journal
Journal of the American Chemical Society
Published
2026-03-23
DOI
https://doi.org/10.1021/jacs.6c01240
Primary Topic
Silicon and Solar Cell Technologies
Type
article
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article

Spatially Quantitative Profiling of Defect Density for Hydrogen-Induced Passivation Mechanism of Metal–Insulator–Semiconductor Photoanodes

P. Zhang, Yangning Zhang, Jinlong Gong, Shujie Wang et al.
Journal of the American Chemical Society
Silicon and Solar Cell Technologies
article

Spatially Quantitative Profiling of Defect Density for Hydrogen-Induced Passivation Mechanism of Metal–Insulator–Semiconductor Photoanodes

P. Zhang, Yangning Zhang, Jinlong Gong, Shujie Wang, Tuo Wang, Yixian Wang, Yuan Xing Cai, Yuting Tong, Gong Zhang, Bin Liu
article en

Abstract

Silicon-based metal-insulator-semiconductor (MIS) photoelectrodes provide a built-in field for photoelectrochemical water splitting but suffer from inefficient charge transport due to carrier recombination at defect sites within the space-charge region. The insulating layer fabricated by atomic layer deposition (ALD) is critical for defect passivation and requires carefully engineered deposition and annealing processes for optimal performance. This necessitates the quantitative analysis of defect density distribution. However, such analysis remains impeded by intrinsic limitations of conventional single-capacitance techniques and the influence of tunneling leakage currents. This paper describes an integrated multicapacitance methodology that combines drive-level capacitance profiling (DLCP) and capacitance-voltage (C-V) techniques to quantify both interface (<i>N</i><sub>it</sub>) and bulk defect charge density (<i>N</i><sub>DLCP</sub>) within the space-charge region, using the space-charge capacitance refined by MIS-adapted multicomponent equivalent circuit modeling. This approach reveals that Al<sub>2</sub>O<sub>3</sub> reduces the <i>N</i><sub>it</sub> at n-Si/ITO interface from approximately 2.9 × 10<sup>16</sup> to 1.4 × 10<sup>16</sup> cm<sup>-3</sup>, while simultaneously profiling the variation of <i>N</i><sub>DLCP</sub> and depletion width. Furthermore, systematic DLCP/C-V analysis enables the design of a tailored passivation protocol by tuning ALD deposition (<i>T</i><sub>dep</sub>) and annealing temperatures to leverage the hydrogen-induced mechanism. Optimal passivation is achieved at a moderate <i>T</i><sub>dep</sub> (∼160 °C) followed by 350 °C annealing, which balances sufficient hydrogen content and suitable structural properties of the Al<sub>2</sub>O<sub>3</sub> film without introducing additional bulk defects during annealing. Eventually, the optimized n-Si/SiO<sub><i>x</i></sub>/Al<sub>2</sub>O<sub>3</sub>/ITO/Ni photoanode exhibits an onset potential of 0.88 V vs RHE and an applied bias photon-to-current efficiency (ABPE) of 2.91%, with a long-term stability of 120 h.

Journal of the American Chemical Society
Tianjin Normal University (CN), Tianjin University (CN), National University of Singapore (SG), Energy Storage Systems (United States) (US), State Key Laboratory of Synthetic Chemistry (CN), Unité Matériaux et Transformations (FR), Collaborative Innovation Center of Chemical Science and Engineering Tianjin (CN)
Openalex Percentile: Top 11%
Silicon and Solar Cell Technologies
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