Advanced Machine Learning Approach for Fast Temperature Estimation in SiC-Based Power Electronics Converters

Accurate and fast junction-temperature estimation in Silicon Carbide (SiC) power modules is crucial for reliable operation, health monitoring and predictive control of power electronic converters in different applications. However, direct temperature measurement inside the module is difficult and high-fidelity thermal models are often very computationally expensive for real-time implementation. This paper proposes a digital twin development approach for fast and accurate temperature estimation in all three dimensions of a SiC MOSFET power module by a combination of finite element method (FEM) modelling and neural networks. The work is especially relevant in thermal monitoring and managing power electronics converters such as renewable energy systems, energy storage systems, Electric Vehicles (EV), etc. The model incorporates a neural network trained on data generated from an FEM model built in COMSOL Multiphysics. The developed digital twin can estimate the temperature distribution, including the ten junction temperatures of the Wolfspeed EAB450M12XM3 module, with an average estimation time of 0.063 s, enabling predictive control. In order to improve practical applicability and model synchronization with the physical system, NTC-based feedback techniques are discussed (single-Temperature Coefficient (NTC) and double-NTC approaches). The proposed framework is investigated in terms of prediction accuracy and computational performance related to the FEM-generated reference data. The approach improves model reliability by adjusting the parameters of the critical digital and physical modules. The combination of FEM-based modelling and machine learning can provide a foundation for accurate, real-time thermal monitoring in power electronic modules.

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Publication Details

Journal
Electronics
Published
2026-03-22
DOI
https://doi.org/10.3390/electronics15061325
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
Field-Weighted Citation Impact
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article

Advanced Machine Learning Approach for Fast Temperature Estimation in SiC-Based Power Electronics Converters

Arman Fathollahi, Sigurd Illum Skov, Jørgen Houe Pedersen, Kalle Bundgaard Troldborg
Electronics
Silicon Carbide Semiconductor Technologies
article

Advanced Machine Learning Approach for Fast Temperature Estimation in SiC-Based Power Electronics Converters

Arman Fathollahi, Sigurd Illum Skov, Jørgen Houe Pedersen, Kalle Bundgaard Troldborg
article en

Abstract

Accurate and fast junction-temperature estimation in Silicon Carbide (SiC) power modules is crucial for reliable operation, health monitoring and predictive control of power electronic converters in different applications. However, direct temperature measurement inside the module is difficult and high-fidelity thermal models are often very computationally expensive for real-time implementation. This paper proposes a digital twin development approach for fast and accurate temperature estimation in all three dimensions of a SiC MOSFET power module by a combination of finite element method (FEM) modelling and neural networks. The work is especially relevant in thermal monitoring and managing power electronics converters such as renewable energy systems, energy storage systems, Electric Vehicles (EV), etc. The model incorporates a neural network trained on data generated from an FEM model built in COMSOL Multiphysics. The developed digital twin can estimate the temperature distribution, including the ten junction temperatures of the Wolfspeed EAB450M12XM3 module, with an average estimation time of 0.063 s, enabling predictive control. In order to improve practical applicability and model synchronization with the physical system, NTC-based feedback techniques are discussed (single-Temperature Coefficient (NTC) and double-NTC approaches). The proposed framework is investigated in terms of prediction accuracy and computational performance related to the FEM-generated reference data. The approach improves model reliability by adjusting the parameters of the critical digital and physical modules. The combination of FEM-based modelling and machine learning can provide a foundation for accurate, real-time thermal monitoring in power electronic modules.

ElectronicsVol. 15(6)
Aarhus University (DK)
Affordable and clean energy
Openalex Percentile: Top 12%
Silicon Carbide Semiconductor Technologies
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