A 2.7 kV AlGaN/GaN high electron mobility transistor with an anti-parallel low turn-on voltage GaN Schottky barrier diode

In this work, AlGaN/GaN reverse conduction HEMTs (RC-HEMTs) integrated with anti-parallel Schottky barrier diodes (SBDs) are demonstrated. Benefiting from the idealized Schottky interface of AlGaN/GaN SBDs with recessed anode, which enables direct contact between GaN channel and anode metal, low reverse turn-on voltage (VR-T) of −0.75 V and high ION/IOFF ratio of 8.5 × 107 are obtained. Based on the randomly measured 100 RC-HEMTs with LGD of 15 μm, ultra-high VR-T uniformity with standard deviation of 18 mV and forward on-resistance (RON) uniformity with standard deviation of 0.3 Ω mm are calculated, respectively. Furthermore, the breakdown voltage of the fabricated AlGaN/GaN RC-HEMT with a 30-μm LGD can reach 2.7 kV, which shows great promise for medium-voltage power applications.

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Publication Details

Journal
Applied Physics Letters
Published
2026-03-16
DOI
https://doi.org/10.1063/5.0316161
Primary Topic
GaN-based semiconductor devices and materials
Type
article
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article

A 2.7 kV AlGaN/GaN high electron mobility transistor with an anti-parallel low turn-on voltage GaN Schottky barrier diode

Longyang Yu, Yipeng Gao, Xiaojing Liu, Wenjie Zhang et al.
Applied Physics Letters
GaN-based semiconductor devices and materials
article

A 2.7 kV AlGaN/GaN high electron mobility transistor with an anti-parallel low turn-on voltage GaN Schottky barrier diode

Longyang Yu, Yipeng Gao, Xiaojing Liu, Wenjie Zhang, Hu Tao, Xinhao WANG, Huake Su, Zeyang Ren, Jincheng Zhang, Xiangdong Li, Lei Xie, Yue Hao, Shengrui Xu, Weidong Zhu
article en

Abstract

In this work, AlGaN/GaN reverse conduction HEMTs (RC-HEMTs) integrated with anti-parallel Schottky barrier diodes (SBDs) are demonstrated. Benefiting from the idealized Schottky interface of AlGaN/GaN SBDs with recessed anode, which enables direct contact between GaN channel and anode metal, low reverse turn-on voltage (VR-T) of −0.75 V and high ION/IOFF ratio of 8.5 × 107 are obtained. Based on the randomly measured 100 RC-HEMTs with LGD of 15 μm, ultra-high VR-T uniformity with standard deviation of 18 mV and forward on-resistance (RON) uniformity with standard deviation of 0.3 Ω mm are calculated, respectively. Furthermore, the breakdown voltage of the fabricated AlGaN/GaN RC-HEMT with a 30-μm LGD can reach 2.7 kV, which shows great promise for medium-voltage power applications.

Applied Physics LettersVol. 128(11)
Xidian University (CN), Shaanxi University of Science and Technology (CN)
Affordable and clean energy
Openalex Percentile: Top 16%
GaN-based semiconductor devices and materials
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