Optimizing Power Electronics Reliability: Advanced Thermal Management & Wire Bond Lifetime Testing

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Publication Details

Journal
IMAPSource Proceedings
Published
2026-02-05
DOI
https://doi.org/10.4071/001c.156305
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
Field-Weighted Citation Impact
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article

Optimizing Power Electronics Reliability: Advanced Thermal Management & Wire Bond Lifetime Testing

Jeff Berlin
IMAPSource Proceedings
Silicon Carbide Semiconductor Technologies
article

Optimizing Power Electronics Reliability: Advanced Thermal Management & Wire Bond Lifetime Testing

Jeff Berlin
article en

Abstract

No abstract available for this paper.
IMAPSource ProceedingsVol. 2025(HiTEC, CICMT, Power)
TESco Associates (United States) (US)
Affordable and clean energy
Openalex Percentile: Top 18%
Silicon Carbide Semiconductor Technologies
DOISourceOpenAlex
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