Plasma cryogenic processes applied to SiO2 deep etching

Authors

Philippe Lefaucheux (ORCID: https://orcid.org/0000-0001-7889-8891)
Thomas Tillocher (ORCID: https://orcid.org/0000-0002-9160-5595)
Rémi Dussart
Loic Becerra
Overzet, Lawrence, J.

Institutions

The University of Texas at Dallas (US)
Groupe de Recherches sur l'Energétique des Milieux Ionisés (FR)

Publication Details

Journal: SPIRE - Sciences Po Institutional REpository
Published: 2025-09-22
Primary Topic: Plasma Diagnostics and Applications
Type: article
Field-Weighted Citation Impact: 0.00

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article

Plasma cryogenic processes applied to SiO2 deep etching

Philippe Lefaucheux, Thomas Tillocher, Rémi Dussart, Loic Becerra et al.

Sep 22, 2025

SPIRE - Sciences Po Institutional REpository

Plasma Diagnostics and Applications

article

Plasma cryogenic processes applied to SiO2 deep etching

Philippe Lefaucheux, Thomas Tillocher, Rémi Dussart, Loic Becerra, Overzet, Lawrence, J.

September 22, 2025article en

Abstract

No abstract available for this paper.

SPIRE - Sciences Po Institutional REpository

The University of Texas at Dallas (US), Groupe de Recherches sur l'Energétique des Milieux Ionisés (FR)

Openalex Percentile: Top 33%

Plasma Diagnostics and Applications

OpenAlex

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Plasma cryogenic processes applied to SiO2 deep etching — Philippe Lefaucheux, Thomas Tillocher, et al. · SPIRE - Sciences Po Institutional REpository (2025) | TGRS Research Map | TGRS