Tailoring Multiscale Microstructures in Cu‐ <i>x</i> Te‐Cr Alloys via Aging: Correlating Te Content With Mechanical and Electrical Properties

This study systematically investigated the influence of Te content (0.18, 0.4, and 0.57 wt%) and aging treatment on the mechanical strength and electrical conductivity of Cu‐ x Te‐0.3Cr alloys ( x = 0.18, 0.4, and 0.57 wt%). After controllled aging at 300°C–550°C for 1 h, the alloys developed a tailored multiscale microstructure consisting of nanoscale Cr precipitates, microscale Cr phases, bar‐shaped secondary Cu 2 Te dispersoids, and dense dislocation networks. This hierarchical microstructure integrates precipitates across nanometer to micrometer scales, dislocation configurations, and grain status, collectively governing the alloy's strength‐conductivity synergy. The results revealed that increasing Te content significantly promoted the formation of Cu 2 Te precipitates, with the quantity and size of these phases exhibiting a strong dependence on Te content. The aging process further induced dense dislocation networks and refined the precipitates, thereby facilitating synergistic strengthening mechanisms. Peak performance was achieved in the Cu‐0.4Te‐0.3Cr alloy after aged at 500°C for 1 h, which attained a Vickers hardness of HV 147 and an electrical conductivity of 85.58% IACS. These enhancements are attributed to the synergistic effects of precipitation strengthening (from coherent nanoscale Cr precipitates and Cu 2 Te dispersoids) and dislocation pinning. This combination effectively impedes dislocation motion while reducing lattice distortion to maintain electron transport efficiency. This work provides a strategic framework for designing high‐performance Cu‐Te‐Cr alloys with optimized strength‐conductivity synergy via tailored multiscale microstructures, thereby advancing their application potential in demanding scenarios such as high‐current connectors for next‐generation energy technologies.