Study on the luminous performance of the same LED chip packaged into different specifications of high-power-density devices

Currently, single high-power-density LED devices can operate stably at several hundred watts, making them a key research focus and enabling widespread application in the industry. To manufacture these devices, multiple chips are closely packed and integrated into packages of various sizes and power ratings for operation across different power levels. High-wattage, high-power-density LED devices operate at hundreds of watts and currents approaching one hundred amperes. Therefore, addressing the research gap in the luminous performance variation of identical LED chips packaged into different device specifications is of significant importance. This study fabricated four blue and white LED devices with different chip counts and investigated their optoelectronic and thermal characteristics under different temperatures. The results show that while devices with more chips achieve higher maximum power, they exhibit lower average per-chip luminous performance. At varying power levels, a more significant decline in average per-chip optical intensity with temperature is observed in devices with higher chip counts. This trend becomes more pronounced at higher power levels and is more severe in white-light devices than in blue-light ones. Devices with different chip counts exhibit distinct per-chip heat dissipation conditions and operating temperatures during operation, as revealed by thermal imaging analysis.