A Review of the Machining Mechanisms in Field-Assisted Cutting of Brittle Materials

Brittle materials such as single crystals, polycrystalline ceramics, and amorphous glass are indispensable in modern industry. Driven by improvements in equipment performance, the required fabrication precision for optical elements and devices has reached nanoscale and is steadily advancing toward atomic level. Despite their outstanding physical and chemical properties, fabricating a defect-free surface with nanometer-level roughness on brittle materials is challenging due to microcracking, brittle fracture and severe tool wear. In recent years, field-assisted cutting has emerged to overcome the bottleneck in ultra-precision cutting of brittle materials. This review summarizes investigations of material removal mechanisms of brittle materials in ultra-precision cutting and surveys representative field-assisted cutting technologies-including laser, vibration, magnetic field, and ion implantation assisted cutting-highlighting how these fields broaden ductile-regime machining and suppress the machining-induced defects. This review further discusses the emerging multi-field coupling strategies and outlines future research directions in machining mechanisms to enable high-efficiency, low-damage, and high-consistency manufacturing of brittle materials.