Contextual High-Throughput 3D Volume Electron Microscopy Data Acquisition Using Artificial Intelligence

One of the greatest challenges when generating large and/or high-resolution three-dimensional (3D) volume electron microscopy (vEM) datasets is long acquisition times. We developed a method that leverages Artificial intelligence algorithms to increase acquisition throughput for 3D datasets by creating an AI-derived mask for the targeted region of interest, referred to as Adaptive Scanning. This allowed for specific structures to be imaged at high resolution, with the surrounding area captured at lower resolution, without artificially generating or enhancing any raw data. We demonstrate that this dynamic-resolution scanning approach significantly reduced acquisition time depending on the number of pixels of interest and was sample agnostic, being compatible with a diverse array of organisms and tissues, including brains, parasites, cultured cells, and plants. This multiresolution strategy has the potential to enhance focused ion beam scanning electron microscopy and other forms of vEM, by increasing time savings by up to twofold or more, enabling routine generation of multiple and/or larger vEM datasets more efficiently, cost-effectively, and allowing more data collection to increase statistical power for comparative studies.

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Publication Details

Journal
Microscopy and Microanalysis
Published
2026-02-21
DOI
https://doi.org/10.1093/mam/ozag014
Primary Topic
Advanced Electron Microscopy Techniques and Applications
Type
article
Field-Weighted Citation Impact
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article

Contextual High-Throughput 3D Volume Electron Microscopy Data Acquisition Using Artificial Intelligence

Daniela Slamková, Lolita Rotkina, Cveta Tomova, Kirk J. Czymmek et al.
Microscopy and Microanalysis
Advanced Electron Microscopy Techniques and Applications
article

Contextual High-Throughput 3D Volume Electron Microscopy Data Acquisition Using Artificial Intelligence

Daniela Slamková, Lolita Rotkina, Cveta Tomova, Kirk J. Czymmek, Bronislav Přibyl, Sanja Sviben, Radek Jančík, Tessa M Burch-Smith, Tereza Hurník Konečná, James A J Fitzpatrick
article en

Abstract

One of the greatest challenges when generating large and/or high-resolution three-dimensional (3D) volume electron microscopy (vEM) datasets is long acquisition times. We developed a method that leverages Artificial intelligence algorithms to increase acquisition throughput for 3D datasets by creating an AI-derived mask for the targeted region of interest, referred to as Adaptive Scanning. This allowed for specific structures to be imaged at high resolution, with the surrounding area captured at lower resolution, without artificially generating or enhancing any raw data. We demonstrate that this dynamic-resolution scanning approach significantly reduced acquisition time depending on the number of pixels of interest and was sample agnostic, being compatible with a diverse array of organisms and tissues, including brains, parasites, cultured cells, and plants. This multiresolution strategy has the potential to enhance focused ion beam scanning electron microscopy and other forms of vEM, by increasing time savings by up to twofold or more, enabling routine generation of multiple and/or larger vEM datasets more efficiently, cost-effectively, and allowing more data collection to increase statistical power for comparative studies.

Microscopy and MicroanalysisVol. 32(2)
Washington University in St. Louis (US), Donald Danforth Plant Science Center (US), Thermo Fisher Scientific (Israel) (IL)
Industry, innovation and infrastructure
Openalex Percentile: Top 19%
Advanced Electron Microscopy Techniques and Applications
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