Optimization of abrasive trajectory in chemical mechanical polishing based on swing speed

High-power laser systems impose extremely stringent requirements on the full-aperture polishing of medium- and large-aperture optical components. To avoid the degradation of optical component performance caused by regular abrasive particle trajectories in chemical mechanical polishing (CMP), a study was conducted on the optimization of abrasive particle trajectories in CMP based on the swing speed of the polishing disc. This paper first analyzes the processing principle of the full-aperture polishing equipment and establishes an abrasive particle trajectory model of CMP. Based on a set of process parameters, simulation experiments on abrasive particle trajectories are carried out from two perspectives: the magnitude of the polishing disc swing speed and the variation mode of the swing speed. After simulation with six different swing speeds, it is found that when the swing speed is close to 0 mm/s or 3 mm/s, the regularity of the abrasive particle trajectories is low, and the abrasive particle trajectories are uniformly distributed on the component surface at a swing speed of 3 mm/s. Following simulations with five different swing speed variation modes, it is found that the regularity of abrasive particle trajectories is independent of the variation period of the swing speed. When uniform swing is adopted, abrasive particle trajectories with lower regularity are obtained, and the working temperature on the component surface is reduced after simulation. The results demonstrate that machining with the swing speed obtained in this study can produce workpieces with a longer service life.