Subtractive Nanofluidics in 65-nm CMOS Copper BEOL Achieve 100-nm Width

This paper presents the first implementation of 100-nm-wide nanofluidics in a 65-nm CMOS chip using a one-step wet-etch to remove the copper routing from the back-end-of-line (BEOL) while maintaining transistor integrity through continuous monitoring of the I<sub>DS</sub>-V<sub>GS</sub> characteristics. Vertical fluidics are also successfully demonstrated by etching through 360 nm × 360 nm-sized vias. A non-destructive laser microscopy technique for imaging fluidic channels at a dimension below the visible-light wavelength is developed.

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Published
2026-01-25
DOI
https://doi.org/10.1109/mems64181.2026.11419275
Primary Topic
Integrated Circuits and Semiconductor Failure Analysis
Type
article
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article

Subtractive Nanofluidics in 65-nm CMOS Copper BEOL Achieve 100-nm Width

Alexander Di, Jun-Chau Chien, Michael Pedowitz
Integrated Circuits and Semiconductor Failure Analysis
article

Subtractive Nanofluidics in 65-nm CMOS Copper BEOL Achieve 100-nm Width

Alexander Di, Jun-Chau Chien, Michael Pedowitz
article en

Abstract

This paper presents the first implementation of 100-nm-wide nanofluidics in a 65-nm CMOS chip using a one-step wet-etch to remove the copper routing from the back-end-of-line (BEOL) while maintaining transistor integrity through continuous monitoring of the I<sub>DS</sub>-V<sub>GS</sub> characteristics. Vertical fluidics are also successfully demonstrated by etching through 360 nm × 360 nm-sized vias. A non-destructive laser microscopy technique for imaging fluidic channels at a dimension below the visible-light wavelength is developed.

Vol. 2026
University of California, Berkeley (US)
Openalex Percentile: Top 24%
Integrated Circuits and Semiconductor Failure Analysis
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