Raman Spectroscopic Analysis of Interface Stress and Interfacial Properties in a New Single Co ₆₈ Fe ₅ Si ₁₂ B ₁₅ Metallic Glass Silk/Epoxy Composite

ABSTRACT A new single Co 68 Fe 5 Si 12 B 15 metallic glass silk/epoxy composite (MGSEC) was prepared by vacuum defoaming and curing technology. The interfacial microscopic stress and properties of a Co 68 Fe 5 Si 12 B 15 metallic glass silk (MGS) and epoxy were studied by a combination of tensile experiment and finite element simulation. The surface roughness of the MGS, the equilibrium contact angle (θ equ ), and interfacial shear strength (ISS) of silk and epoxy were tested to study the bonding mechanism of the MGSEC interface. The Raman spectra technique is verified and first innovatively applied to the analysis of the tensile micro‐interface stress. It may develop into a new method for nondestructive testing and damage source location of composite. To further research the stress of the MGS, the finite element simulation of the tensile experiment of the single MGSEC was carried out by using the ABAQUS software. The crack of the MGSEC first appeared at its interface and then the MGS fractured. The numerical simulation results were consistent with the test ones. These study results are of reference significance in predicting both macroscopic and microscopic mechanical properties of the composite and surface coating materials.