Influence of Surface Morphology of High-Carbon Steel on Roughness of Copper Coating Fabricated During Electrolysis of Aqueous KOH Solution with Copper Anode

Electrodeposition of copper on the surface of the high-carbon steel (HCS) cathode was carried out in situ during the electrolysis of an aqueous KOH solution with a copper anode. A mechanism was proposed for the transfer of the copper from the anode to the cathode, followed by the formation of a copper film on the HCS. The surface roughness of the substrate and the copper coating was studied using AFM and profilographic data. There is a discrepancy between the roughness values of the substrate and coating obtained using different techniques. The surface morphology of the substrate was found to affect the copper film quality. The roughness of the copper coating calculated using AFM data replicated the roughness of the substrate surface. It was found that, despite some difference in the roughness calculated by profilographic and AFM data, the overall roughness trend remains unchanged.

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Publication Details

Journal
Inorganics
Published
2026-03-11
DOI
https://doi.org/10.3390/inorganics14030079
Primary Topic
Electrodeposition and Electroless Coatings
Type
article
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article

Influence of Surface Morphology of High-Carbon Steel on Roughness of Copper Coating Fabricated During Electrolysis of Aqueous KOH Solution with Copper Anode

Alexander Felde, Alexey D. Kouptsov, Svetlana V. Sidorova, Alexandre N. Zakharov
Inorganics
Electrodeposition and Electroless Coatings
article

Influence of Surface Morphology of High-Carbon Steel on Roughness of Copper Coating Fabricated During Electrolysis of Aqueous KOH Solution with Copper Anode

Alexander Felde, Alexey D. Kouptsov, Svetlana V. Sidorova, Alexandre N. Zakharov
article en

Abstract

Electrodeposition of copper on the surface of the high-carbon steel (HCS) cathode was carried out in situ during the electrolysis of an aqueous KOH solution with a copper anode. A mechanism was proposed for the transfer of the copper from the anode to the cathode, followed by the formation of a copper film on the HCS. The surface roughness of the substrate and the copper coating was studied using AFM and profilographic data. There is a discrepancy between the roughness values of the substrate and coating obtained using different techniques. The surface morphology of the substrate was found to affect the copper film quality. The roughness of the copper coating calculated using AFM data replicated the roughness of the substrate surface. It was found that, despite some difference in the roughness calculated by profilographic and AFM data, the overall roughness trend remains unchanged.

InorganicsVol. 14(3)
P.N. Lebedev Physical Institute of the Russian Academy of Sciences (RU), Bauman Moscow State Technical University (RU)
Openalex Percentile: Top 27%
Electrodeposition and Electroless Coatings
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