SEU-Hardened High-Speed SRAM Design with Self-Refresh and Adjacent-Bit Error Correction

This paper proposes a high-speed static random access memory (SRAM) architecture that integrates a self-refresh mechanism with a novel single error and adjacent-bit errors correction (SEABEC) scheme to enhance resilience against single-event upsets (SEUs) in radiation-prone environments. By leveraging extended Hamming coding and dynamic circuits, the design achieves a 29.1% RW speed improvement, reduces SEU cross-section by one order of magnitude, and incurs a 29.8% area overhead and a 95.2% dynamic power increase of the ECC module, leading to an overall chip area increase of ~14.2% compared to static logic-based RH SEC-DED SRAM. Radiation experiments validate superior tolerance across a LET range of 1.63-21.8 MeV·cm<sup>2</sup>/mg, demonstrating nearly doubled SEU resilience compared to conventional SEC-DED-based designs. This work balances error correction capabilities with system efficiency, making it suitable for high-reliability applications in space electronics and advanced processors.

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Publication Details

Journal
Micromachines
Published
2026-03-11
DOI
https://doi.org/10.3390/mi17030342
Primary Topic
Radiation Effects in Electronics
Type
article
Field-Weighted Citation Impact
0.00

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article

SEU-Hardened High-Speed SRAM Design with Self-Refresh and Adjacent-Bit Error Correction

Jingli Qi, Tianwen Li, Jianbing Tian
Micromachines
Radiation Effects in Electronics
article

SEU-Hardened High-Speed SRAM Design with Self-Refresh and Adjacent-Bit Error Correction

Jingli Qi, Tianwen Li, Jianbing Tian
article en

Abstract

This paper proposes a high-speed static random access memory (SRAM) architecture that integrates a self-refresh mechanism with a novel single error and adjacent-bit errors correction (SEABEC) scheme to enhance resilience against single-event upsets (SEUs) in radiation-prone environments. By leveraging extended Hamming coding and dynamic circuits, the design achieves a 29.1% RW speed improvement, reduces SEU cross-section by one order of magnitude, and incurs a 29.8% area overhead and a 95.2% dynamic power increase of the ECC module, leading to an overall chip area increase of ~14.2% compared to static logic-based RH SEC-DED SRAM. Radiation experiments validate superior tolerance across a LET range of 1.63-21.8 MeV·cm<sup>2</sup>/mg, demonstrating nearly doubled SEU resilience compared to conventional SEC-DED-based designs. This work balances error correction capabilities with system efficiency, making it suitable for high-reliability applications in space electronics and advanced processors.

MicromachinesVol. 17(3)
Beijing Automation Control Equipment Institute (CN)
China Academy of Space Technology, Young Scientists Fund
Affordable and clean energy
Openalex Percentile: Top 27%
Radiation Effects in Electronics
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