Flexible Electronic Devices Encapsulation Technology: Materials, Processes, and Applications

Abstract The rapid advancement of electronic devices toward miniaturization, ultrathinness, lightweight design, and wearable functionality has rendered conventional rigid encapsulation technologies inadequate. In response, flexible electronic encapsulation has emerged as a critical enabler, integrating flexible electronics with compliant materials to ensure reliable operation under mechanical deformation such as bending and folding. However, significant challenges remain, including the optimization of material performance, process complexity, and long-term reliability—particularly in balancing mechanical flexibility with electrical conductivity and overcoming the limitations of traditional fabrication methods. This review comprehensively summarizes recent progress in flexible encapsulation technologies, with a focus on key advances in materials, processing techniques, and application domains. Finally, we discuss future trends toward intelligent, miniaturized, and highly reliable systems, offering insights for next-generation flexible electronics.