Additive Manufacturing Technologies for Electronic Integration and Packaging

Authors

Arashdeep Singh (ORCID: https://orcid.org/0000-0001-6087-7240)
Ahsan Mian

Institutions

Wright State University (US)

Publication Details

Journal: Electronic Materials
Published: 2026-03-04
DOI: https://doi.org/10.3390/electronicmat7010006
Primary Topic: Nanomaterials and Printing Technologies
Type: article
Field-Weighted Citation Impact: 0.00

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article

Additive Manufacturing Technologies for Electronic Integration and Packaging

Arashdeep Singh, Ahsan Mian

Mar 4, 2026

Electronic Materials

Nanomaterials and Printing Technologies

article

Additive Manufacturing Technologies for Electronic Integration and Packaging

Arashdeep Singh, Ahsan Mian

March 4, 2026article en

Abstract

No abstract available for this paper.

Electronic MaterialsVol. 7(1)

Wright State University (US)

Openalex Percentile: Top 36%

Nanomaterials and Printing Technologies

DOI Open Access PDF OpenAlex

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Additive Manufacturing Technologies for Electronic Integration and Packaging — Arashdeep Singh, Ahsan Mian · Electronic Materials (2026) | TGRS Research Map | TGRS