Ga Doping Enables Precision Alloy‐to‐Wire Regulation: Synergistic Enhancement of the Mechanical Properties of CuSn Alloy and the Superconducting Properties of Nb <sub>3</sub> Sn

Cu-Sn alloy is a key raw material used in the preparation of Nb<sub>3</sub>Sn superconducting wires using the bronze method. The mechanical properties of this Cu-Sn alloy are directly responsible for determining the properties of the superconducting wires. The superconducting properties of Nb<sub>3</sub>Sn can be significantly improved by Ga doping. However, the effect of Ga doping and the amount thereof on the properties of Cu-Sn alloys has rarely been reported. In this study, the distribution of Ga and its impact on the mechanical properties of Cu-Sn alloys are investigated via experiments and simulations. The results indicate that Cu and Ga readily produce strong electron exchange and a stable solid-solution structure, leading to Ga superiority in the solid-solution competition with Sn and to δ phase segregation. For the first time, a 1.0 wt.% Ga-added Cu-Sn alloy exhibiting an excellent elongation of 100.8% was successfully prepared. Further investigation revealed that with increasing Ga content, the activation of planar fault slip systems becomes more difficult, the volume fraction of planar fault structures gradually decreases, and the dislocation dissociation distance decreases as cross-slip occurs. The simulation results revealed that as Ga doping increases, the matrix stacking fault energy increases and the deformation mechanism shifts from being dominated by twinning to a balanced combination of slip and twinning, which is the primary mechanism for the synergistic enhancement of strength and ductility in the alloy. In addition, Ga doping significantly elevated the superconducting transition temperature of Nb<sub>3</sub>Sn by approximately 0.85 K and improved the critical current density. This study innovatively demonstrates that compared to the front-end Cu-Sn alloy, the addition of 1.0 wt.% Ga achieves synergistic property enhancement of the back-end Nb<sub>3</sub>Sn superconducting wire. This study provides both a theoretical and experimental foundation for the preparation of Cu-Sn alloys with elevated properties for use in Nb<sub>3</sub>Sn superconducting wires.

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Journal
Advanced Science
Published
2026-02-25
DOI
https://doi.org/10.1002/advs.202515530
Primary Topic
Superconducting Materials and Applications
Type
article
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article

Ga Doping Enables Precision Alloy‐to‐Wire Regulation: Synergistic Enhancement of the Mechanical Properties of CuSn Alloy and the Superconducting Properties of Nb 3 Sn

Rong Fei, Lixing Sun, Tong Dang, Dazhuo Song et al.
Advanced Science
Superconducting Materials and Applications
article

Ga Doping Enables Precision Alloy‐to‐Wire Regulation: Synergistic Enhancement of the Mechanical Properties of CuSn Alloy and the Superconducting Properties of Nb 3 Sn

Rong Fei, Lixing Sun, Tong Dang, Dazhuo Song, Yuchen Song, Lin Shi, J. Zhang, Xinhang Liang, Shaodong Sun, Yifan Liu, Lei Zhu, Zhe Zhang, Jingqi Feng, Yuxuan Wang, Juntao Zou, Mengyu Shan
article en

Abstract

Cu-Sn alloy is a key raw material used in the preparation of Nb<sub>3</sub>Sn superconducting wires using the bronze method. The mechanical properties of this Cu-Sn alloy are directly responsible for determining the properties of the superconducting wires. The superconducting properties of Nb<sub>3</sub>Sn can be significantly improved by Ga doping. However, the effect of Ga doping and the amount thereof on the properties of Cu-Sn alloys has rarely been reported. In this study, the distribution of Ga and its impact on the mechanical properties of Cu-Sn alloys are investigated via experiments and simulations. The results indicate that Cu and Ga readily produce strong electron exchange and a stable solid-solution structure, leading to Ga superiority in the solid-solution competition with Sn and to δ phase segregation. For the first time, a 1.0 wt.% Ga-added Cu-Sn alloy exhibiting an excellent elongation of 100.8% was successfully prepared. Further investigation revealed that with increasing Ga content, the activation of planar fault slip systems becomes more difficult, the volume fraction of planar fault structures gradually decreases, and the dislocation dissociation distance decreases as cross-slip occurs. The simulation results revealed that as Ga doping increases, the matrix stacking fault energy increases and the deformation mechanism shifts from being dominated by twinning to a balanced combination of slip and twinning, which is the primary mechanism for the synergistic enhancement of strength and ductility in the alloy. In addition, Ga doping significantly elevated the superconducting transition temperature of Nb<sub>3</sub>Sn by approximately 0.85 K and improved the critical current density. This study innovatively demonstrates that compared to the front-end Cu-Sn alloy, the addition of 1.0 wt.% Ga achieves synergistic property enhancement of the back-end Nb<sub>3</sub>Sn superconducting wire. This study provides both a theoretical and experimental foundation for the preparation of Cu-Sn alloys with elevated properties for use in Nb<sub>3</sub>Sn superconducting wires.

Advanced Science
Xi'an University of Science and Technology (CN), Xi’an University (CN), Xi'an University of Technology (CN)
Openalex Percentile: Top 45%
Superconducting Materials and Applications
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