Fast and Accurate Source Reconstruction for TSV-Based Chips via Contribution-Driven Dipole Pruning

Electromagnetic compatibility (EMC) diagnostics for high-density through-silicon via (TSV)-based chips face significant challenges due to complex three-dimensional electromagnetic coupling and inefficient source reconstruction workflows. This paper proposes a universal contribution-driven dipole preprocessing technique tailored for dipole array-based source reconstruction methods, addressing the critical efficiency-accuracy trade-off inherent in traditional approaches. The core innovation is an influence factor-based evaluation-elimination mechanism that extracts effective dipole components aligned with the structural characteristics of TSV-based chips and multilayer printed circuit boards, while eliminating redundant dipoles independently of the downstream source reconstruction algorithm. Validation on a multilayer PCB (1 GHz) and a TSV-based chip (4 GHz) demonstrates that the technique maintains high reconstruction accuracy, with error increase limited to ≤0.2% for the simulated PCB and ≤0.05% for the physically measured TSV-based chip. Computational time is reduced by 28–61% for the PCB and 20–28% for the TSV chip compared to traditional source reconstruction without preprocessing. For TSV-based chips exhibiting complex electromagnetic behavior, the technique delivers consistent performance across different dipole configurations, providing a fast, robust, and universal EMC diagnostic tool for high-density electronic devices.