Thermal and Dielectric Properties of Elastomeric Silicone-Based Films Filled with Hexagonal Boron Nitride

Main thermal and dielectric properties of hexagonal boron nitride and silicone elastomer-based composite films are described. Films consisted of up to 47 vol % of filler. Maximal thermal conductivity reached 6 W/m K (1400% improvement over neat elastomer) at thermal conductivity anisotropy level ca. 2, weakly depending on measurement temperature. Materials demonstrated excellent dielectric properties. Concentration correlations of thermal conductivity were described using modern models, as well as compared to the best published data.