Solidification cracking of refractory alloys: a computational and machine learning study to investigate composition-dependence for improved weldability and additive manufacturability

Large-batch numerical, CALculation of PHAse Diagrams (CALPHAD)-based solidification cracking calculations are performed and then analyzed with machine learning methods to generate models that relate chemistry of refractory alloys to cracking susceptibility. Kou’s solidification cracking index is used to study the refractory alloys including O, N, C binary mixtures with Mo, Ta, Nb, and W, the molybdenum-based TZM, Niobium-based C103, and Tantalum-based T111 and Ta-10 W, as well as hypothetical refractory ternary alloys. Findings strongly validate Kou’s Crack Susceptibility Index (CSI) against Varestraint test data for Nb- and Ta-based alloys, establishing CSI thresholds where refractory alloys with CSI < 15,000 K are likely weldable, CSI > 15,000 K are prone to cracking, and CSI > 25,000 K are likely unweldable (or unprintable). Furthermore, interstitial elements C, N, and O significantly increase crack susceptibility, with some existing material specifications coinciding with peak cracking susceptibility concentrations. Finally, machine learning-derived elemental potency factors enable rapid prediction of CSI from alloy chemistry for C103, TZM, Ta-10 W, and T-111 alloys. These results provide practical guidance for feedstock selection, powder reuse limits, and alloy specification amendments for welding and additive manufacturing applications.

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Publication Details

Journal
Materials & Design
Published
2026-02-15
DOI
https://doi.org/10.1016/j.matdes.2026.115679
Primary Topic
Additive Manufacturing Materials and Processes
Type
article
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article

Solidification cracking of refractory alloys: a computational and machine learning study to investigate composition-dependence for improved weldability and additive manufacturability

Jeffrey W. Sowards, Andrew O’Connor, Fredrick N. Michael, Ellis Crabtree et al.
Materials & Design
Additive Manufacturing Materials and Processes
article

Solidification cracking of refractory alloys: a computational and machine learning study to investigate composition-dependence for improved weldability and additive manufacturability

Jeffrey W. Sowards, Andrew O’Connor, Fredrick N. Michael, Ellis Crabtree, Omar Mireles
article en

Abstract

Large-batch numerical, CALculation of PHAse Diagrams (CALPHAD)-based solidification cracking calculations are performed and then analyzed with machine learning methods to generate models that relate chemistry of refractory alloys to cracking susceptibility. Kou’s solidification cracking index is used to study the refractory alloys including O, N, C binary mixtures with Mo, Ta, Nb, and W, the molybdenum-based TZM, Niobium-based C103, and Tantalum-based T111 and Ta-10 W, as well as hypothetical refractory ternary alloys. Findings strongly validate Kou’s Crack Susceptibility Index (CSI) against Varestraint test data for Nb- and Ta-based alloys, establishing CSI thresholds where refractory alloys with CSI < 15,000 K are likely weldable, CSI > 15,000 K are prone to cracking, and CSI > 25,000 K are likely unweldable (or unprintable). Furthermore, interstitial elements C, N, and O significantly increase crack susceptibility, with some existing material specifications coinciding with peak cracking susceptibility concentrations. Finally, machine learning-derived elemental potency factors enable rapid prediction of CSI from alloy chemistry for C103, TZM, Ta-10 W, and T-111 alloys. These results provide practical guidance for feedstock selection, powder reuse limits, and alloy specification amendments for welding and additive manufacturing applications.

Materials & DesignVol. 263
Openalex Percentile: Top 55%
Additive Manufacturing Materials and Processes
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Solidification cracking of refractory alloys: a computational and machine learning study to investigate composition-dependence for improved weldability and additive manufacturability — Jeffrey W. Sowards, Andrew O’Connor, et al. · Materials & Design (2026) | TGRS Research Map | TGRS