High-Power and Fiber-Solid Hybrid MOPA Nanosecond Laser for High-Efficiency 4H-SiC Wafers Slicing

Laser slicing of 4H-SiC wafers offers high efficiency and minimal material loss. While nanosecond lasers are the preferred light source, simultaneously achieving high output power, excellent beam quality (M2 < 1.3), and broad operational tunability remains an outstanding challenge. This study developed a highly efficient nanosecond laser source using hybrid fiber and solid-state multi-stage amplification architecture. With excellent beam quality (M2 < 1.3), it achieves the highest output power, widest continuously tunable pulse width range, and broadest repetition rate range currently reported for 4H-SiC laser slicing. This advancement is poised to advance the continued development of 4H-SiC slicing technology.