Efficient, Non‐Destructive Transfer of Wafer‐Scale Monolayer MoS <sub>2</sub> by Interface Engineering (Adv. Funct. Mater. 12/2026)
Interface Engineering This cover image illustrates efficient, non-destructive transfer of wafer-scale monolayer MoS2 through interface engineering. The visual highlights MoS2 on the surface with a magnifying crystal structure, a PDMS interface, and a sapphire substrate. Lifted films reveal weak substrate bonding, offering new insights toward transfer and device application for 2D materials. More information can be found in the Research Article by Zhihua Zhang, Dongxia Shi, Luojun Du, and co-workers (10.1002/adfm.202517643).
Authors
- H J Zhang
- Dongxia Shi
- Yongqing Cai (ORCID: https://orcid.org/0000-0002-2348-9318)
- Luojun Du
- Lu Li
- Liyan Zhang
- Jieying Liu
- Zhihua Zhang
- Qinqin Wang
- Jian Tang
- Zheng Wei
Institutions
- Chinese Academy of Sciences (CN)
- Dalian University of Technology (CN)
- Dalian University (CN)
- Songshan Lake Materials Laboratory (CN)
- Institute of Physics (CN)
- University of Chinese Academy of Sciences (CN)
- Dalian Jiaotong University (CN)
Publication Details
- Journal
- Advanced Functional Materials
- Published
- 2026-02-01
- DOI
- https://doi.org/10.1002/adfm.73861
- Primary Topic
- 2D Materials and Applications
- Type
- article
- Field-Weighted Citation Impact
- 0.00