Semiconductor Manufacturers Feel the Heat

Authors

Publication Details

Journal
Communications of the ACM
Published
2026-02-11
DOI
https://doi.org/10.1145/3788651
Primary Topic
Heat Transfer and Numerical Methods
Type
article
Field-Weighted Citation Impact
0.00
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article

Semiconductor Manufacturers Feel the Heat

Samuel Greengard
Communications of the ACM
Heat Transfer and Numerical Methods
article

Semiconductor Manufacturers Feel the Heat

Samuel Greengard
article en

Abstract

No abstract available for this paper.
Communications of the ACMVol. 69(3)
Affordable and clean energy
Openalex Percentile: Top 55%
Heat Transfer and Numerical Methods
DOISourceOpenAlex
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Semiconductor Manufacturers Feel the Heat — Samuel Greengard · Communications of the ACM (2026) | TGRS Research Map | TGRS