Optimizing thickness uniformity in double-pulse nickel electroforming via a physics-guided COMSOL®–ANN–WOA framework

The thickness uniformity of electroformed layers critically determines the dimensional accuracy, surface quality, and reliability of micro-electroformed devices. This work investigates nickel deposition under double-pulse current with a focus on quantifying the effects of positive-pulse current <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" display="inline" overflow="scroll"> <mml:msub> <mml:mi>I</mml:mi> <mml:mrow> <mml:mrow> <mml:mi mathvariant="normal">avg</mml:mi> </mml:mrow> <mml:mo>,</mml:mo> <mml:mrow> <mml:mi mathvariant="normal">a</mml:mi> </mml:mrow> </mml:mrow> </mml:msub> </mml:math> , negative-pulse current <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" display="inline" overflow="scroll"> <mml:msub> <mml:mi>I</mml:mi> <mml:mrow> <mml:mrow> <mml:mi mathvariant="normal">avg</mml:mi> </mml:mrow> <mml:mo>,</mml:mo> <mml:mrow> <mml:mi mathvariant="normal">c</mml:mi> </mml:mrow> </mml:mrow> </mml:msub> </mml:math> , and duty-cycle fractions D a : D c on thickness inhomogeneity and morphology, training and validating an artificial neural network (ANN) surrogate for rapid prediction, and ultimately identifying an optimal pulse window under practical bounds. With a fixed negative pulse, increasing the positive-pulse current (0.032 to 0.035 A) steadily reduces macroscopic thickness uniformity; the best uniformity occurs at 0.032 A, while the microstructure evolves from compact equiaxed grains to oriented/needle-like and eventually coarse faceted textures. Duty-cycle modulation strongly improves uniformity: raising D a : D c from 0.50:0.15 to 0.575:0.075 reduces thickness inhomogeneity from 352% to 125%. A crested porcupine optimizer (CPO)-initialized back-propagation artificial neural network (BP-ANN) surrogate trained on 1610 COMSOL ® -generated samples (70/30 split) maps power-supply parameters to thickness inhomogeneity α and serves as a rapid proxy for simulations. Coupled with the Whale Optimization Algorithm (WOA) for single-objective minimization of α , the framework identifies optimal pulse parameters ( a 1 – a 4 ) = (0.0412 A, 0.066 A, 0.549, 0.081), yielding α ≈ 96.5% in simulation and verified experimentally by bright, fine-grained deposits with improved uniformity. A physics-guided hybrid framework is proposed—integrating COMSOL ® secondary-distribution data into a CPO-initialized BP-ANN surrogate, followed by optimization using the WOA—which delivers experimentally validated improvements in thickness uniformity without auxiliary cathodes or shields, relying on pulse shaping alone.

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Journal
Proceedings of the Institution of Mechanical Engineers Part E Journal of Process Mechanical Engineering
Published
2026-02-09
DOI
https://doi.org/10.1177/09544089261419665
Primary Topic
Electrodeposition and Electroless Coatings
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article
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article

Optimizing thickness uniformity in double-pulse nickel electroforming via a physics-guided COMSOL®–ANN–WOA framework

Kui Sheng Song, Chen Chen, Jingang Liu
Proceedings of the Institution of Mechanical Engineers Part E Journal of Process Mechanical Engineering
Electrodeposition and Electroless Coatings
article

Optimizing thickness uniformity in double-pulse nickel electroforming via a physics-guided COMSOL®–ANN–WOA framework

Kui Sheng Song, Chen Chen, Jingang Liu
article en

Abstract

The thickness uniformity of electroformed layers critically determines the dimensional accuracy, surface quality, and reliability of micro-electroformed devices. This work investigates nickel deposition under double-pulse current with a focus on quantifying the effects of positive-pulse current <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" display="inline" overflow="scroll"> <mml:msub> <mml:mi>I</mml:mi> <mml:mrow> <mml:mrow> <mml:mi mathvariant="normal">avg</mml:mi> </mml:mrow> <mml:mo>,</mml:mo> <mml:mrow> <mml:mi mathvariant="normal">a</mml:mi> </mml:mrow> </mml:mrow> </mml:msub> </mml:math> , negative-pulse current <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" display="inline" overflow="scroll"> <mml:msub> <mml:mi>I</mml:mi> <mml:mrow> <mml:mrow> <mml:mi mathvariant="normal">avg</mml:mi> </mml:mrow> <mml:mo>,</mml:mo> <mml:mrow> <mml:mi mathvariant="normal">c</mml:mi> </mml:mrow> </mml:mrow> </mml:msub> </mml:math> , and duty-cycle fractions D a : D c on thickness inhomogeneity and morphology, training and validating an artificial neural network (ANN) surrogate for rapid prediction, and ultimately identifying an optimal pulse window under practical bounds. With a fixed negative pulse, increasing the positive-pulse current (0.032 to 0.035 A) steadily reduces macroscopic thickness uniformity; the best uniformity occurs at 0.032 A, while the microstructure evolves from compact equiaxed grains to oriented/needle-like and eventually coarse faceted textures. Duty-cycle modulation strongly improves uniformity: raising D a : D c from 0.50:0.15 to 0.575:0.075 reduces thickness inhomogeneity from 352% to 125%. A crested porcupine optimizer (CPO)-initialized back-propagation artificial neural network (BP-ANN) surrogate trained on 1610 COMSOL ® -generated samples (70/30 split) maps power-supply parameters to thickness inhomogeneity α and serves as a rapid proxy for simulations. Coupled with the Whale Optimization Algorithm (WOA) for single-objective minimization of α , the framework identifies optimal pulse parameters ( a 1 – a 4 ) = (0.0412 A, 0.066 A, 0.549, 0.081), yielding α ≈ 96.5% in simulation and verified experimentally by bright, fine-grained deposits with improved uniformity. A physics-guided hybrid framework is proposed—integrating COMSOL ® secondary-distribution data into a CPO-initialized BP-ANN surrogate, followed by optimization using the WOA—which delivers experimentally validated improvements in thickness uniformity without auxiliary cathodes or shields, relying on pulse shaping alone.

Proceedings of the Institution of Mechanical Engineers Part E Journal of Process Mechanical Engineering
Xiangtan University (CN)
Openalex Percentile: Top 62%
Electrodeposition and Electroless Coatings
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