Recent Progress in Silicon-Based On-Chip Integrated Infrared Photodetectors

Infrared (IR) photodetectors are indispensable to modern optoelectronic systems, ranging from night vision imaging, surveillance, and industrial process control to environmental monitoring and medical diagnostics. However, traditional detectors based on bulk semiconductors are constrained by prohibitive fabrication costs and the stringent requirement for bulky cryogenic cooling, which severely hinders their widespread deployment in Size, Weight, and Power (SWaP)-sensitive scenarios. Silicon-based on-chip integration, leveraging compatibility with mature CMOS processes, has emerged as a transformative paradigm. It enables the realization of fully functional photonic integrated circuits (PICs) capable of on-chip sensing and high-speed data transmission, offering a pathway toward miniaturized and cost-effective architectures. This article provides a review of recent progress in silicon-based infrared photodetectors across three core material systems: Group IV (Ge/GeSn), III-V compounds, and two-dimensional (2D) materials. In the end, we offer an outlook on the development trends of next-generation intelligent sensing systems driven by optoelectronic convergence.

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Publication Details

Journal
Sensors
Published
2026-02-09
DOI
https://doi.org/10.3390/s26041125
Primary Topic
Photonic and Optical Devices
Type
article
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article

Recent Progress in Silicon-Based On-Chip Integrated Infrared Photodetectors

Qiandong Zhuang, Jiaju Wei, Chunxu Song, Yu He et al.
Sensors
Photonic and Optical Devices
article

Recent Progress in Silicon-Based On-Chip Integrated Infrared Photodetectors

Qiandong Zhuang, Jiaju Wei, Chunxu Song, Yu He, Zeyu Wang, Peng Cao, Wanhua Zheng
article en

Abstract

Infrared (IR) photodetectors are indispensable to modern optoelectronic systems, ranging from night vision imaging, surveillance, and industrial process control to environmental monitoring and medical diagnostics. However, traditional detectors based on bulk semiconductors are constrained by prohibitive fabrication costs and the stringent requirement for bulky cryogenic cooling, which severely hinders their widespread deployment in Size, Weight, and Power (SWaP)-sensitive scenarios. Silicon-based on-chip integration, leveraging compatibility with mature CMOS processes, has emerged as a transformative paradigm. It enables the realization of fully functional photonic integrated circuits (PICs) capable of on-chip sensing and high-speed data transmission, offering a pathway toward miniaturized and cost-effective architectures. This article provides a review of recent progress in silicon-based infrared photodetectors across three core material systems: Group IV (Ge/GeSn), III-V compounds, and two-dimensional (2D) materials. In the end, we offer an outlook on the development trends of next-generation intelligent sensing systems driven by optoelectronic convergence.

SensorsVol. 26(4)
Chinese Academy of Sciences (CN), Institute of Semiconductors (CN), University of Chinese Academy of Sciences (CN), Lancaster University (GB)
Openalex Percentile: Top 62%
Photonic and Optical Devices
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