Numerical Modeling and Experimental Analysis of Structural Integrity Monitoring of Mechanical Systems based on Electromechanical Impedance

Abstract The electromechanical impedance-based structural health monitoring technique (ISHM) has proven to be effective in detecting faults in various types of engineering structures. However, understanding how it works is essential for optimizing its application. For this reason, a finite element model was developed in the present work by using the ANSYS ® software to represent the results obtained by the ISHM technique. With an accurate representation of this technique, it is possible to select the ideal piezoelectric transducer by appropriately defining its type, position, and size for being bonded to (or incorporated into) the monitored structure. This approach not only contributes to reducing experimental costs but also enhances the effectiveness of damage identification. In addition to the proposed model, a sensitivity analysis is presented to identify the most influential parameters. In this sense, different adhesive layer thicknesses were also evaluated, comparing experimental and numerical results for both healthy and damaged conditions. The results indicate that, despite variations in impedance signatures, there is a consistent trend involving both simulation and experimental results, as confirmed by the obtained damage indices. This approach enhances the application of the ISHM technique by providing a better understanding of its behavior, enabling a more precise implementation.