Research on the Engineering and Technological Features of the 3D Assembly and Mounting of a Functional Micromodule

In order to create electronic products based on advanced technologies, new design options are required that take into account the possibilities of switching elements and components distributed in a limited volume. Flexible boards currently have no alternative in terms of providing maximum switching density, as well as in the 3D assembly and mounting of micromodules. This paper examines the developed technological processes for the assembly and mounting of a functional micromodule with a shield against external effects. The simulation is carried out using the finite element method for computer-aided implementation. A dimensional picture of the strain and stress distribution in the functional module is obtained. It is shown that the created design allows us to reduce the weight and size characteristics, increase reliability, and provide effective heat dissipation, electromagnetic shielding, and vibration isolation of micromodules. A new method for assembling silicon crystals using stops is proposed. The materials are selected and the resulting stresses in the connection are studied. The optimal data with the minimal stress concentration factors are identified to ensure the strength and functioning of materials, which makes it possible to increase the endurance of connections under cyclic thermomechanical effects. Based on the developed finite element models of materials, including computational models, as well as the nodes of the functional micromodule and the principles of their use, an analysis of the stress-strain state, thermal processes, the effectiveness of electromagnetic shielding, methods of protection from vibration and shock, and calculation of strength and durability is carried out, which makes it possible to rationally select materials, assembly and mounting methods, and the design of elements and connections.