Photovoltaic Module Heat Dissipation Enhancement by Optimizing Backsheet Encapsulation Material's Thermal Conductivity and Thickness: A 3D FEM Model and Its Experimental Validation

To enhance the heat dissipation performance and operational stability of photovoltaic (PV) modules, this study developed a three‐dimensional heat transfer model of PV modules using the finite element method. It systematically examined the impacts of the thermal conductivity and thickness of encapsulation materials, as well as environmental factors, on the temperature characteristics of solar cells. Experimental validation was carried out by manufacturing thermally conductive PV modules, and the application effect of thermally conductive materials in the PV/PCM (phase change material) system was concurrently analyzed. Increasing the thermal conductivity of the backsheet encapsulation material for crystalline silicon cells can notably reduce the front temperature of PV modules, the solar cell temperature, and the temperature difference between the front and rear sides. Meanwhile, it can raise the module rear side temperature and improve the uniformity of the temperature distribution. Specifically, when the thermal conductivity reaches 1.0 W·m −1 K −1 , the temperature of solar cells can be effectively controlled. For example, under natural environmental conditions, the maximum temperature reduction of solar cells reaches 2.12°C. Meanwhile, the solar cell temperature increases with the thickness of the encapsulation material, at a rate of 0.68°C·mm −1 . In the PV/PCM system, the thermally conductive material can extend the time the cell temperature remains below 40°C by 19 min, achieving a maximum temperature reduction of 3.83°C. The experimental results are generally consistent with the simulation results, confirming that optimizing the encapsulation material parameters can effectively enhance the heat dissipation performance of PV modules and thereby improve their efficiency.