Dandelion‐Inspired Radial Oriented Microspheres for Dynamic Interface Thermal Management (Adv. Funct. Mater. 11/2026)

Dynamic Interface Thermal Management In their Research Article (10.1002/adfm.202520631), Wei Feng, Mengmeng Qin, and co-workers draw inspiration from the radial structure of dandelion to develop an innovative, custom-composite strategy tailored for elastic thermal interface materials (TIMs). By constructing dandelion-inspired microspheres, they create a synergistically enhanced 3D thermal network featuring high thermal conductivity and excellent mechanical compliance. This 3D thermal networks-based TIMs exhibit stable and efficient thermal management capabilities under dynamic stress, paving the way for advanced thermal management in next-generation flexible electronics and aerospace systems.

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Publication Details

Journal
Advanced Functional Materials
Published
2026-02-01
DOI
https://doi.org/10.1002/adfm.73794
Primary Topic
Thermal properties of materials
Type
article
Field-Weighted Citation Impact
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article

Dandelion‐Inspired Radial Oriented Microspheres for Dynamic Interface Thermal Management (Adv. Funct. Mater. 11/2026)

Zhixing Zhang, Yanshuai Duan, Mengmeng Qin, Wei Feng et al.
Advanced Functional Materials
Thermal properties of materials
article

Dandelion‐Inspired Radial Oriented Microspheres for Dynamic Interface Thermal Management (Adv. Funct. Mater. 11/2026)

Zhixing Zhang, Yanshuai Duan, Mengmeng Qin, Wei Feng, Qingxia He
article en

Abstract

Dynamic Interface Thermal Management In their Research Article (10.1002/adfm.202520631), Wei Feng, Mengmeng Qin, and co-workers draw inspiration from the radial structure of dandelion to develop an innovative, custom-composite strategy tailored for elastic thermal interface materials (TIMs). By constructing dandelion-inspired microspheres, they create a synergistically enhanced 3D thermal network featuring high thermal conductivity and excellent mechanical compliance. This 3D thermal networks-based TIMs exhibit stable and efficient thermal management capabilities under dynamic stress, paving the way for advanced thermal management in next-generation flexible electronics and aerospace systems.

Advanced Functional MaterialsVol. 36(11)
Tianjin University (CN)
Openalex Percentile: Top 66%
Thermal properties of materials
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