A Low-Viscosity Glycidyl Amine from Industrial Byproducts toward High-Performance Epoxy Resins with Balanced Toughness, Strength, Hydrophobicity, and Thermal Stability

A low-viscosity and storable glycidyl amine (IHMGA) was synthesized from industrial byproducts (IHMXDA) and used to modify bisphenol A epoxy resin (DGEBA). When the addition amount of IHMGA was 5 wt %, the cured product (IA-5.0) maintained high thermal stability (T10% = 375.2 °C) and high glass transition temperature (TgDMA = 172.4 °C) and showed significant improvements in mechanical properties: impact strength increased by 113.3%, tensile strength by 47.53%, and elongation at break by 81%. The material simultaneously demonstrated outstanding solvent resistance and hydrophobicity, achieving a water contact angle of 101.1°. Curing kinetics revealed that IHMGA reduced the activation energy (Ea) by 2.18 kJ/mol and accelerated the curing process, which was well described by the Šesták–Berggren model. This study pioneers the incorporation of antiaging agent byproducts into epoxy resin systems, achieving dual benefits: high-value utilization of industrial byproducts and comprehensive performance enhancement of the epoxy resin.

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Publication Details

Journal
ACS Applied Polymer Materials
Published
2026-02-02
DOI
https://doi.org/10.1021/acsapm.5c03995
Primary Topic
Epoxy Resin Curing Processes
Type
article
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article

A Low-Viscosity Glycidyl Amine from Industrial Byproducts toward High-Performance Epoxy Resins with Balanced Toughness, Strength, Hydrophobicity, and Thermal Stability

Meisi Chen, Xinbao Zhu, Zeyuan Chen, Yuting Ma et al.
ACS Applied Polymer Materials
Epoxy Resin Curing Processes
article

A Low-Viscosity Glycidyl Amine from Industrial Byproducts toward High-Performance Epoxy Resins with Balanced Toughness, Strength, Hydrophobicity, and Thermal Stability

Meisi Chen, Xinbao Zhu, Zeyuan Chen, Yuting Ma, Yucheng Yao, Zhengan Miao, Jihuai Tan, Zhengren Jia, Fang Wang
article en

Abstract

A low-viscosity and storable glycidyl amine (IHMGA) was synthesized from industrial byproducts (IHMXDA) and used to modify bisphenol A epoxy resin (DGEBA). When the addition amount of IHMGA was 5 wt %, the cured product (IA-5.0) maintained high thermal stability (T10% = 375.2 °C) and high glass transition temperature (TgDMA = 172.4 °C) and showed significant improvements in mechanical properties: impact strength increased by 113.3%, tensile strength by 47.53%, and elongation at break by 81%. The material simultaneously demonstrated outstanding solvent resistance and hydrophobicity, achieving a water contact angle of 101.1°. Curing kinetics revealed that IHMGA reduced the activation energy (Ea) by 2.18 kJ/mol and accelerated the curing process, which was well described by the Šesták–Berggren model. This study pioneers the incorporation of antiaging agent byproducts into epoxy resin systems, achieving dual benefits: high-value utilization of industrial byproducts and comprehensive performance enhancement of the epoxy resin.

ACS Applied Polymer MaterialsVol. 8(3)
Nanjing Forestry University (CN), Anhui Special Equipment Inspection Institute (CN), Hua Medicine (China) (CN)
Affordable and clean energy
Openalex Percentile: Top 70%
Epoxy Resin Curing Processes
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