Tailored Annealing for Interfacial Design and Mechanical Optimization of Cu18150/Al1060/Cu18150 Trilayer Composites

Copper–aluminum layered composites offer a promising combination of high conductivity, light weight, and cost-effectiveness, making them attractive for applications in electric vehicles, electronics, and power transmission. However, achieving reliable interfacial bonding while avoiding excessive work hardening and brittle intermetallic formation remains a significant challenge. In this study, a Cu18150/Al1060/Cu18150 trilayer composite was fabricated through a three-stage high-temperature oxygen-free rolling process. Subsequently, the produced composite was subjected to annealing treatments to systematically investigate the effects of rolling passes, annealing temperature/time on interfacial evolution and mechanical behavior. Results indicate that rolling passes primarily influence interfacial topography and defect distribution. Fewer passes lead to wavy, mechanically bonded interfaces, while more passes improve flatness but reduce intermetallic continuity. Annealing temperature critically governs diffusion kinetics; temperatures up to 400 °C promote the formation of a uniform Al2Cu layer, whereas 450 °C accelerates the growth of brittle Al4Cu9, thickening the intermetallic layer to 18 μm and compromising toughness. Annealing duration further modulates diffusion mechanisms, with short-term (0.5 h) treatments favoring defect-assisted diffusion, resulting in a porous, rapidly thickened layer. In contrast, longer annealing (≥1 h) shifts toward lattice diffusion, which densifies the interface but risks excessive brittle phase formation if prolonged. Mechanical performance evolves accordingly; as-rolled strength increases with the number of rolling passes, but at the expense of ductility. Annealing transforms bonding from a mechanical to a metallurgical condition, shifting fracture from delamination to collaborative failure. The identified optimal process, single-pass rolling followed by annealing at 420 °C for 1 h, yields a balanced interfacial structure of Al2Cu, AlCu, and Al4Cu9 phases, achieving a tensile strength of 258.9 MPa and an elongation of 28.2%, thereby satisfying the target performance criteria (≥220 MPa and ≥20%).