Modellering en experimentele karakterisering van consolidatiegedrag tijdens de verwerking van thermoplastische composieten

A modeling technique along with experimental characterizations, will be implemented to assess the consolidation behavior of thermoplastic composites. This includes the development of intimate contact between two surfaces of thermoplastics composite tapes under pressure and temperature, and simultaneously, intermolecular diffusion of polymers chains, known as autohesion. In addition to the tape specifications, process parameters including temperature, pressure, and time play an indispensable role during consolidation. Moreover, due to the presence of micro-scale roughness on the surface of prepreg tapes, it is paramount to investigate the governing flow mechanism for the flattening of surface asperities, eliminating interlaminar void content and subsequently, to reach a perfect interlaminar bonding.

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Publication Details

Journal
Lirias (KU Leuven)
Published
2026-02-06
Primary Topic
Epoxy Resin Curing Processes
Type
article
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article

Modellering en experimentele karakterisering van consolidatiegedrag tijdens de verwerking van thermoplastische composieten

Sepehr Simaafrookhteh
Lirias (KU Leuven)
Epoxy Resin Curing Processes
article

Modellering en experimentele karakterisering van consolidatiegedrag tijdens de verwerking van thermoplastische composieten

Sepehr Simaafrookhteh
article en

Abstract

A modeling technique along with experimental characterizations, will be implemented to assess the consolidation behavior of thermoplastic composites. This includes the development of intimate contact between two surfaces of thermoplastics composite tapes under pressure and temperature, and simultaneously, intermolecular diffusion of polymers chains, known as autohesion. In addition to the tape specifications, process parameters including temperature, pressure, and time play an indispensable role during consolidation. Moreover, due to the presence of micro-scale roughness on the surface of prepreg tapes, it is paramount to investigate the governing flow mechanism for the flattening of surface asperities, eliminating interlaminar void content and subsequently, to reach a perfect interlaminar bonding.

Lirias (KU Leuven)
Openalex Percentile: Top 73%
Epoxy Resin Curing Processes
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