Small Form Factor MEMS Packages

The continued adaptation of microelectromechanical systems (MEMS) technology for various applications in consumer, automotive, industrial, communications and even health & lifestyle markets has accelerated innovations in design and assembly for MEMS packages. These innovations address various challenges in integration, reliability, scalability and cost. The common driver that has a significant impact on the identified challenges is the form factor. Aside from enabling sensor functionality, the commercial scalability and ease-of-integration to end-customer devices are some of the keys drivers for MEMS and sensor packages’ form factor. Form factor influences the integration potential of a sensor module and determines how many components can be packaged altogether thereby reducing the overall footprint. It also establishes the path for manufacturing scalability which helps in accelerating the development timeline and shortening time-to-market. Form factor also defines board mount compatibility and reliability requirements and has become a common line-item on most package technology roadmaps. Amkor Technology understands these challenges and continues to provide solutions by leveraging its extensive experiences in diverse package platforms. As a result, it has developed a toolbox for advanced packaging technologies supporting Heterogenous Integration (HI) and standard packages for consumer, industrial and automotive applications. The extensive experience, supported by a capable design and the assembly toolbox becomes the development framework for small form factor MEMS and sensor packages. This paper focuses on the design aspects and package structures as well as assembly techniques to enable form factor reduction for MEMS and sensor packages. It describes the evolution of MEMS package platforms and the strategies to align with the industry’s demand for higher integration potential, better reliability, efficient scalability and commercialization.