Power, Performance, and Packaging: The 3 P’s Driving Infrastructure & Progress

With the explosion in data-intensive applications and the drive toward sustainability, industry players face mounting pressure to enhance performance and manage energy consumption. This talk will explore the critical challenges facing data center operators, connecting those issues to innovations and architectural choices systems and chip designers are making to addressing those challenges and enable continued scaling of the enterprise, AI, and cloud computing infrastructure. By setting a clear industry context, the talk will provide a foundation for understanding the urgent role of packaging advancements in meeting future demands.