Breaking Barriers in Semiconductor Packaging: Leveraging Glass-Based Substrates for Superior Connectivity

This presentation introduces a novel, simplified packaging concept utilizing glass-based substrates to achieve next-generation connectivity. By leveraging glass as the core material, we can achieve unprecedented trace widths and micro-via dimensions, enabling differentiated interconnection designs for high-performance computing and high-speed communication devices. Additionally, the integration of devices into the glass core enhances both signal transmission and power delivery. The glass-based substrate solution addresses stringent data transmission specifications, such as Universal Chiplet Interconnect Express (UCIe) and Non-Volatile Memory Host Controller Interface Specification (NVMHCIS). By implementing ultra-fine design rules, this approach offers bespoke packaging options for high-bandwidth applications. The industry adoption of this innovative solution represents a pivotal advancement in overcoming traditional chip scaling limitations, enabling improved system performance, reduced energy consumption, and scalable chiplet solutions. Moreover, glass-based substrates contribute to a more sustainable semiconductor industry. The reduced metal layers and improved energy efficiency translate to lower resource consumption and a smaller carbon footprint. Adopting this technology can significantly decrease the environmental impact of semiconductor manufacturing, aligning with global efforts to promote greener and more sustainable practices. In summary, the adoption of glass-based substrates for chiplet interconnects marks a significant leap forward in semiconductor packaging technology. This innovative approach not only addresses the current challenges of reliability and turnaround times but also sets new benchmarks for performance and efficiency in high-bandwidth applications. By leveraging the unique properties of glass, ultra-fine design rules and enhanced signal integrity can be achieved, paving the way for scalable and energy-efficient chiplet solutions. The real-world application examples presented will underscore the transformative potential of this technology, highlighting its role in driving the next generation of high-performance computing and communication devices.