M-Series Fan-out Interposer Technology (MFIT) with Vertical Interconnect Blocks

As semiconductor devices become increasingly complex, heterogeneous integration has become essential to meet the demands of high-performance applications. Advanced packaging technologies are required to integrate multiple functional components into a compact form factor, all while achieving the electrical performance, mechanical stability, and manufacturability required for high volume production. The M-Series Fan-out Interposer Technology (M FIT) directly addresses these challenges by combining molded fan-out redistribution layer (RDL) technology with embedded bridge die. These bridge die, fabricated using the same RDL technology, serve as high-bandwidth, low-latency interconnects between active chiplets. This paper details the process flow for M FIT, with a focus on the benefits of RDL-based bridge die and the opportunity to fabricate the interposer in a carrier-less full thickness process with prefabricated interconnect blocks.